9th TIIP International Forum - Global AI Intellectual Property Summit

Lee & Lee LLP is delighted to have been invited to the 9th TIIP International Forum – Global AI Intellectual Property Summit, held in Shenzhen on 14 to 15 August 2026.

Our Senior Partner,  Tan Tee Jim, SC, was invited to speak at the Forum’s panel discussion on the Technological Innovation and Intellectual Property in the AI Era. Bringing together leaders from industry, research institutions and the legal profession, the panel explored the opportunities and challenges presented by AI, including intellectual property ownership, regulatory compliance, and the ethical and professional implications of AI-assisted legal services. “I was impressed by the other speakers on the panel as well as in the forum who displayed deep domain knowledge of AI and its developments in China”, said Mr Tan.  

As AI continues to reshape business and the law, Lee & Lee remains committed to help our clients navigate emerging issues, protect their innovations, and seize opportunities in the rapidly evolving field of AI.